Additional information
CPU | 2 4th Generation Intel®Xeon®Sapphire Rapids / 5th Generation Intel®Xeon®Emerald Rapids SP series 64 Cores for each Processor and 385W power consumption |
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Chipset | Inte®C741 |
Memory | 32 DDR5 RDIMM Slots, 5600 MT/s Data Rate, 8TB* on 2 CPU Configuration Additional 16 expansion memory slots via CXL1 |
Raid Controller | Dedicated PCIe HBA Controller or Raid Controller Standard PCIe HBA Controller or Raid Controller |
FBWC | 8 GB Cache, support Supercapacitor protection |
Storage | 24 U.2 NVMe Drives,SATA/NVMe M.2 Kit, 29 DrivesSAS/SATA HDD/SSD Drives, DSD Model (2 x SD card kit) Front 12LFF bays, Rear 4LFF baysFront 25SFF bays, Rear 4SFF bays4 Drive Tri-Mode Backplane |
Network | 1 Onboard 1Gbps Management Network Port2 Onboard OCP 3.0 Slots for 4 GE or 2 10GE or 2 25GE or 2 100GE NICs PCIe Standard Slots for 1/10/25/100/200GE Ethernet Adapter |
Expansion slots | 10 PCIe Standard Slots (6 PCIe5.0 and 4 PCIe4.0) and 2 Onboard OCP 3.0 SlotsCXL1.1Supports Full-OCP architecture and can support up to 8 OCP3.0 slots* |
Ports | Standard |
GPU | 8 Single-Slot or 4 Dual-Slot GPU Modules |
Optical Drive | External Optical Disk Drive, Optional |
Management | 64M Video Cache, HDM Management System (with dedicated management port) H3C iFIST/UniSystem, LCD touchable model |
Security | Intelligent Front Security Bezel Chassis Intrusion Detection TPM2.02FA for HDM Intel SGX2.0 |
Power Supply | 1+1 Redundancy power supply Titanium 850/1600WPlatinum 800W/1300W/1600W/2000W/2400W/2700WDC power supplyHot swappable Redundant Fans |
Standards | CE,UL, etc., FCC,VCCI,CB |
Operating Temperature | 5°C to 45°C (41°F to 113°F) |
Dimensions(H×W×D) | 2U HeightWithout a security bezel |
Brand | H3C |
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