Additional information
Computing | 2 × Intel® Xeon® Scalable processors (Up to 28 cores and maximum 165 W power consumption) |
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Chipset | Intel® C621 |
Memory | 24 × DDR4 DIMMs 3.0 TB (maximum)(Up to 2933 MT/s data transfer rate and support for both RDIMM and LRDIMM)(Up to 12 Intel ® Optane™ DC Persistent Memory Module.(DCPMM) Optional NVDIMM* |
Storage controller | 1, 10, 1E and Simple Volume) (Optional)Standard PCIe HBA cards and storage controllers (Optional)NVMe RAID, 5, 50, 6, 60, and 10) (Optional)Mezzanine storage controller (RAID 0, and 10)Mezzanine HBA card (SATA/SAS RAID 0, Embedded RAID controller (SATA RAID 0 |
FBWC | 4 GB cache |
Storage | Support SAS/SATA/NVMe U.2 DrivesFront 24LFF; Rear 12LFF+4LFF(2LFF)+4SFF;Support internal 4LFF* or 8SFF*;Optional 10 NVMe drivesSupport SATA M.2 optional part |
Network | 100G LAN Card or 56G/100G IB card, 25G, Support 10G |
PCIe slots | 10 × PCIe 3.0 slots (8 standard slots, and one for Ethernet adapter), one for Mezzanine storage controller |
Ports | Rear VGA connector and serial port3 × USB 3.0 connectors (two at the rear and one at the front) |
GPU | 8 × single-slot wide or 2 x double-slot GPU modules* |
Optical Drive | External optical drive |
Management | HDM (with dedicated management port) and H3C FIST |
Security | Support Chassis Intrusion Detection TPM2.0 |
Power supply and Cooling | 2 x 550W/850W/1300W or 800W –48V DC power supplies (1+1 Redundant Power Supply)80Plus certification, up to 94% energy conversion efficiencyHot swappable fans (supports 4+1 Redundancy) |
Standards | CE,UL, etc., FCC,VCCI,EAC |
Operating Temperature | 5°C to 40°C (41°F to 104°F)Storage Temperature:-40~85ºC(-41°F to 185°F)The maximum operating temperature varies by server configuration. For more information, see the technical documentation for the device. |
Dimensions (H x W x D) | 4U HeightWithout a security bezel |
Brand | H3C |
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