Additional information
CPU | 2 x 3rd generation Intel® Xeon® Ice Lake SP series(each processor up to 40 cores and maximum 270W power consumption) |
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Chipset | Intel® C621A |
Memory | 32 x DDR4 DIMM slots, maximum 6.0 TB Up to 3200 MT/s data transfer rate RDIMMUp to 16 Intel ® Optane™ DC Persistent Memory Module PMem 200 series ( Barlow Pass) |
Storage controller | Embedded RAID controllerStandard PCIe HBA cards and storage controllers,depending on model |
FBWC | 8 GB DDR4 cache, depending on model, support Supercapacitor protection |
Storage | depending on model, maximum 8 x U.2 NVMe DrivesSATA/PCIe M.2 SSDs,2 x SD card kit, Rear 2SFF bays*Front SAS/SATA HDD/SSD/NMVe Drives, Rear 2SFF bays*Up to Front 10SFF bays, Up to Front 4LFF bays |
Network | 1 x onboard 1 Gbps management network port1 x OCP 3.0 slot for 4 x 1GE or 2 x 10GE or 2 x 25GE NICPCIe Standard slots for 1/10/25/40/100GE/IB Ethernet adapter, |
PCIe slots | 4 x PCIe 4.0 standard slots |
Ports | 2 rear, and 2 internal)1 dedicated management Type-C port, VGA connectors (Front and Rear) and serial port (RJ-45)5 x USB 3.0 ports (1 front |
GPU | 4 x single-slot wide GPU modules |
Optical Drive | External optical disk drive,optional |
Management | HDM OOB system (with dedicated management port) and H3C iFIST/FIST, support LCD touchable smart model |
Security | Intelligent Front Security Bezel *Chassis Intrusion DetectionTPM2.0Silicon Root of Trust 2FA for HDM |
Power Supply | 2 x Platinum 550W/800W/850W/1300W/1600W (1+1 redundancy), depending on model800W –48V DC power supply (1+1 Redundancy)Hot swappable redundant fans |
Standards | CE,UL, etc., FCC,VCCI,EAC |
Operating Temperature | 5°C to 45°C (41°F to 113°F)The maximum operating temperature varies by server configuration. For more information, see the technical documentation for the device. |
Dimensions (H x W x D) | 1U HeightWithout a security bezel |
Brand | H3C |
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