Additional information
| CPU | 2 4th Generation Intel®Xeon® Sapphire Rapids / 5th Generation Intel®Xeon® Emerald Rapids SP series 64 Cores for each Processor and 385W power consumptionHBM technology |
|---|---|
| Chipset | Intel®C741 |
| Memory | 32 DDR5 RDIMM Slots, 5600 MT/s Data Rate, 8TB on 2 CPU Configuration with 256G DDR5 RDIMM |
| Raid Controller | Dedicated PCIe HBA Controller or Raid Controller* Standard PCIe HBA Controller or Raid Controller |
| FBWC | 8 GB Cache, support Supercapacitor protection |
| Storage | 12 U.2 NVMe Drives SATA/NVMe M.2 Kit, DSD module (2xSD card kit), Front 10SFF bays, Rear 2SFF bays Front 4LFF baysSAS/SATA HDD/SSD Drives |
| Network | 1 Onboard 1Gbps Management Network Port2 Onboard OCP 3.0 Slots for 4 GE or 2 10GE or 2 25GE or 2 100GE NICs PCIe Standard Slots for 1/10/25/100GE Ethernet Adapter, IB card |
| Expansion slots | 4 PCIe Standard Slots (3 PCIe5.0 and 1 PCIe4.0) and 2 Onboard OCP 3.0 SlotsCXL1.1 |
| Ports | Standard |
| GPU | 4 Single-Slot GPU Modules |
| Optical Drive | External Optical Disk Drive, Optional |
| Management | 64M Video Cache, HDM Management System (with dedicated management port) H3C iFIST/UniSystem, LCD touchable model |
| Security | Intelligent Front Security Bezel* Chassis Intrusion Detection TPM2.0Silicon Root of Trust 2FA for HDMIntel SGX2.0 and PFR3.0 |
| Power Supply | 1+1 Redundancy power supply Titanium 850/1600WPlatinum 800W/1300W/1600W/2000W DC power supply8 Hot swappable Redundant Fans |
| Standards | CE，UL, etc., FCC，VCCI，CB |
| Operating Temperature | 5°C to 45°C (41°F to 113°F) * |
| Dimensions(H×W×D) | 1U HeightWithout a security bezel |
| Brand | H3C |
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